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1

Printed wire interconnection using Ag sinter paste for wide band gap power semiconductors

Noh, Seungjun, Choe, Chanyang, Chen, Chuantong, Zhang, Hao, Suganuma, Katsuaki

Journal:

Journal of Materials Science: Materials in Electronics

Année:

2018

Langue:

english

Fichier:

PDF, 2.42 MB

english, 2018

2

Stochastic Optimal Control for Energy Internet: A Bottom-up Energy Management Approach

Hua, Haochen, Qin, Yuchao, Hao, Chuantong, Cao, Junwei

Journal:

IEEE Transactions on Industrial Informatics

Année:

2018

Langue:

english

Fichier:

PDF, 788 KB

english, 2018

3

Large-area die-attachment by silver stress migration bonding for power device applications

Noh, Seungjun, Zhang, Hao, Yeom, Jeyun, Chen, Chuantong, Li, Caifu, Suganuma, Katsuaki

Journal:

Microelectronics Reliability

Année:

2018

Langue:

english

Fichier:

PDF, 1.72 MB

english, 2018

4

[IEEE 2016 China Semiconductor Technology International Conference (CSTIC) - Shanghai, China (2016.3.13-2016.3.14)] 2016 China Semiconductor Technology International Conference (CSTIC) - A novel mechanism of silver microflakes sinter joining

Zhang, Hao, Nagao, Shijo, Lin, Shih-kang, Yokoi, Emi, Chen, Chuantong, Suganuma, Katsuaki

Année:

2016

Langue:

english

Fichier:

PDF, 1.97 MB

english, 2016

5

Thermal Fatigue Behavior of Silicon-Carbide-Doped Silver Microflake Sinter Joints for Die Attachment in Silicon/Silicon Carbide Power Devices

Zhang, Hao, Chen, Chuantong, Nagao, Shijo, Suganuma, Katsuaki

Journal:

Journal of Electronic Materials

Année:

2017

Langue:

english

Fichier:

PDF, 3.03 MB

english, 2017

6

Mechanical Deformation of Sintered Porous Ag Die Attach at High Temperature and Its Size Effect for Wide-Bandgap Power Device Design

Chen, Chuantong, Nagao, Shijo, Zhang, Hao, Jiu, Jinting, Sugahara, Tohru, Suganuma, Katsuaki, Iwashige, Tomohito, Sugiura, Kazuhiko, Tsuruta, Kazuhiro

Journal:

Journal of Electronic Materials

Année:

2017

Langue:

english

Fichier:

PDF, 3.16 MB

english, 2017

7

[IEEE 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2016.5.31-2016.6.3)] 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - Low-Stress Design for SiC Power Modules with Sintered Porous Ag Interconnection

Chen, Chuantong, Nagao, Shijo, Zhang, Hao, Sugahara, Tohru, Suganuma, Katsuaki, Iwashige, Tomohito, Sugiura, Kazuhiko, Tsuruta, Kazuhiro

Année:

2016

Langue:

english

Fichier:

PDF, 2.13 MB

english, 2016

8

A Class of Control Strategies for Energy Internet Considering System Robustness and Operation Cost Optimization

Hua, Haochen, Hao, Chuantong, Qin, Yuchao, Cao, Junwei

Journal:

Année:

2018

Langue:

english

Fichier:

PDF, 5.04 MB

english, 2018

9

Robust Mixed H2/H∞ Controller Design for Energy Routers in Energy Internet

Hua, Haochen, Qin, Yuchao, Geng, Jianye, Hao, Chuantong, Cao, Junwei

Journal:

Année:

2019

Langue:

english

Fichier:

PDF, 5.95 MB

english, 2019

10

[IEEE 2019 IEEE Applied Power Electronics Conference and Exposition (APEC) - Anaheim, CA, USA (2019.3.17-2019.3.21)] 2019 IEEE Applied Power Electronics Conference and Exposition (APEC) - A Novel Power Router with General AC and DC Port

Zhang, Tao, Yao, Gang, Zhou, Lidan, Jin, Nan, Cao, Junwei, Hu, Junfeng, Hao, Chuantong

Année:

2019

Langue:

english

Fichier:

PDF, 953 KB

english, 2019

11

[IEEE 2019 20th International Conference on Electronic Packaging Technology(ICEPT) - Hong Kong, China (2019.8.12-2019.8.15)] 2019 20th International Conference on Electronic Packaging Technology(ICEPT) - Sinterability improvement of hybrid silver sinter joining paste by adding silver nanoparticles

Egawa, Tomoya, Zhang, Hao, Kobatake, Takanori, Akai, Yasuyuki, Chen, Chuantong, Suganuma, Katsuaki

Année:

2019

Fichier:

PDF, 2.76 MB

2019

12

Self-healing of cracks in Ag joining layer for die-attachment in power devices

Chen, Chuantong, Nagao, Shijo, Suganuma, Katsuaki, Jiu, Jinting, Zhang, Hao, Sugahara, Tohru, Iwashige, Tomohito, Sugiura, Kazuhiko, Tsuruta, Kazuhiro

Journal:

Applied Physics Letters

Année:

2016

Langue:

english

Fichier:

PDF, 1.42 MB

english, 2016

13

Dry-growth of silver single-crystal nanowires from porous Ag structure

Chen, Chuantong, Nagao, Shijo, Jiu, Jinting, Zhang, Hao, Sugahara, Tohru, Suganuma, Katsuaki

Journal:

Applied Physics Letters

Année:

2016

Langue:

english

Fichier:

PDF, 2.43 MB

english, 2016

14

Highly reliable and highly conductive submicron Cu particle patterns fabricated by low temperature heat-welding and subsequent flash light sinter-reinforcement

Li, Wanli, Zhang, Hao, Gao, Yue, Jiu, Jinting, Li, Cai-Fu, Chen, Chuantong, Hu, Dawei, Goya, Yusuke, Wang, Yutao, Koga, Hirotaka, Nagao, Shijo, Suganuma, Katsuaki

Journal:

Journal of Materials Chemistry C

Année:

2017

Langue:

english

Fichier:

PDF, 3.01 MB

english, 2017

15

Macroscale and microscale fracture toughness of microporous sintered Ag for applications in power electronic devices

Chen, Chuantong, Nagao, Shijo, Suganuma, Katsuaki, Jiu, Jinting, Sugahara, Tohru, Zhang, Hao, Iwashige, Tomohito, Sugiura, Kazuhiko, Tsuruta, Kazuhiro

Journal:

Acta Materialia

Année:

2017

Langue:

english

Fichier:

PDF, 6.54 MB

english, 2017

16

Electrochemical behavior of Zn- x Sn high-temperature solder alloys in 0.5 M NaCl solution

Wang, Zhenghong, Chen, Chuantong, Jiu, Jinting, Nagao, Shijo, Nogi, Masaya, koga, Hirotaka, Zhang, Hao, Zhang, Gong, Suganuma, Katsuaki

Journal:

Journal of Alloys and Compounds

Année:

2017

Langue:

english

Fichier:

PDF, 4.98 MB

english, 2017

17

[IEEE 2017 29th International Symposium on Power Semiconductor Devices and IC's (ISPSD) - Sapporo, Japan (2017.5.28-2017.6.1)] 2017 29th International Symposium on Power Semiconductor Devices and IC's (ISPSD) - Prominent interface structure and bonding material of power module for high temperature operation

Sugiura, Kazuhiko, Iwashige, Tomohito, Kawai, Jun, Tsuruta, Kazuhiro, Chen, Chuantong, Nagao, Shijo, Zhang, Hao, Sugahara, Tohru, Suganuma, Katsuaki, Kurosaka, Seigo, Sakuma, Yuichi, Oda, Yukinori

Année:

2017

Fichier:

PDF, 638 KB

2017

18

Effect of electroplated Au layer on bonding performance of Ag pastes

Fan, Taikun, Zhang, Hao, Shang, Panju, Li, Caifu, Chen, Chuantong, Wang, Jianxin, Liu, Zhiquan, Zhang, Hao, Suganuma, Katsuaki

Journal:

Journal of Alloys and Compounds

Année:

2017

Langue:

english

Fichier:

PDF, 2.57 MB

english, 2017

19

Bonding technology based on solid porous Ag for large area chips

Chen, Chuantong, Noh, Seungjun, Zhang, Hao, Choe, Chanyang, Jiu, Jinting, Nagao, Shijo, Suganuma, Katsuaki

Journal:

Scripta Materialia

Année:

2018

Langue:

english

Fichier:

PDF, 1.96 MB

english, 2018

20

High-temperature reliability of low-temperature and pressureless micron Ag sintered joints for die attachment in high-power device

Zhang, Hao, Chen, Chuantong, Jiu, Jinting, Nagao, Shijo, Suganuma, Katsuaki

Journal:

Journal of Materials Science: Materials in Electronics

Année:

2018

Langue:

english

Fichier:

PDF, 4.89 MB

english, 2018

21

[IEEE 2017 18th International Conference on Electronic Packaging Technology (ICEPT) - Harbin, China (2017.8.16-2017.8.19)] 2017 18th International Conference on Electronic Packaging Technology (ICEPT) - Solvent effect on pressureless and low-temperature sintering of Ag paste for die-attachment in high-power devices

Zhang, Hao, Chen, Chuantong, Jiu, Jinting, Suganuma, Katsuaki

Année:

2017

Langue:

english

Fichier:

PDF, 637 KB

english, 2017

22

[IEEE 2018 IEEE International Conference on Energy Internet (ICEI) - Beijing, China (2018.5.21-2018.5.25)] 2018 IEEE International Conference on Energy Internet (ICEI) - Design and Application of Standardized Power and Communication Module for Energy Router

Hao, Chuantong, Cao, Junwei

Année:

2018

Langue:

english

Fichier:

PDF, 361 KB

english, 2018

23

[IEEE 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC) - Mie, Japan (2018.4.17-2018.4.21)] 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC) - Ag joint bonding technology for bare copper substrate in low temperature, pressureless and air condition

Zhang, Zheng, Chen, Chuantong, Zhang, Hao, Nagao, Shijo, Suganuma, Katsuaki

Année:

2018

Langue:

english

Fichier:

PDF, 3.94 MB

english, 2018

24

Novel copper particle paste with self-reduction and self-protection characteristics for die attachment of power semiconductor under a nitrogen atmosphere

Gao, Yue, Li, Wanli, Chen, Chuantong, Zhang, Hao, Jiu, Jinting, Li, Cai-Fu, Nagao, Shijo, Suganuma, Katsuaki

Journal:

Materials & Design

Année:

2018

Langue:

english

Fichier:

PDF, 1.60 MB

english, 2018

25

Low-temperature and pressureless sinter joining of Cu with micron/submicron Ag particle paste in air

Zhang, Zheng, Chen, Chuantong, Yang, Yang, Zhang, Hao, Kim, Dongjin, Sugahara, Toru, Nagao, Shijo, Suganuma, Katsuaki

Journal:

Journal of Alloys and Compounds

Année:

2019

Langue:

english

Fichier:

PDF, 13.50 MB

english, 2019

26

[IEEE 2018 IEEE International Conference on Smart Energy Grid Engineering (SEGE) - Oshawa, ON (2018.8.12-2018.8.15)] 2018 IEEE International Conference on Smart Energy Grid Engineering (SEGE) - A Class of Optimal and Robust Controller Design for Energy Routers in Energy Internet

Hao, Chuantong, Qin, Yuchao

Année:

2018

Langue:

english

Fichier:

PDF, 8.03 MB

english, 2018

27

[IEEE 2018 IEEE PES Asia-Pacific Power and Energy Engineering Conference (APPEEC) - Kota Kinabalu, Malaysia (2018.10.7-2018.10.10)] 2018 IEEE PES Asia-Pacific Power and Energy Engineering Conference (APPEEC) - Robust Controller Design for Energy Router in Energy Internet via Mixed $\mathrm{H}_{2}/\mathrm{H}\infty$ Control Technique

Hao, Chuantong, Hua, Haochen, Qin, Yuchao, Cao, Junwei

Année:

2018

Langue:

english

Fichier:

PDF, 2.13 MB

english, 2018

28

[IEEE 2018 International Power Electronics Conference (IPEC-Niigata 2018-ECCE Asia) - Niigata (2018.5.20-2018.5.24)] 2018 International Power Electronics Conference (IPEC-Niigata 2018 -ECCE Asia) - Bonding technology using cold-rolled Ag sheet in die-attachment applications

Noh, Seungjun, Choe, Chanyang, Chen, Chuantong, Zhang, Hao, Suganuma, Katsuaki

Année:

2018

Langue:

english

Fichier:

PDF, 3.04 MB

english, 2018

29

[IEEE 2018 IEEE PES Asia-Pacific Power and Energy Engineering Conference (APPEEC) - Kota Kinabalu (2018.10.7-2018.10.10)] 2018 IEEE PES Asia-Pacific Power and Energy Engineering Conference (APPEEC) - Stochastic Optimal Control Scheme for Operation Cost Management in Energy Internet

Hua, Haochen, Qin, Yuchao, Hao, Chuantong, Cao, Junwei, Yang, Yilin

Année:

2018

Langue:

english

Fichier:

PDF, 1.37 MB

english, 2018

30

[IEEE 2019 IEEE Applied Power Electronics Conference and Exposition (APEC) - Anaheim, CA, USA (2019.3.17-2019.3.21)] 2019 IEEE Applied Power Electronics Conference and Exposition (APEC) - A Novel Power Router with General AC and DC Port

Zhang, Tao, Yao, Gang, Zhou, Lidan, Jin, Nan, Cao, Junwei, Hu, Junfeng, Hao, Chuantong

Année:

2019

Fichier:

PDF, 953 KB

2019

31

Reactive wafer bonding with nanoscale Ag/Cu multilayers

Liu, Yu-chen, Lin, Shih-kang, Zhang, Hao, Nagao, Shijo, Chen, Chuantong, Suganuma, Katsuaki

Journal:

Scripta Materialia

Année:

2020

Fichier:

PDF, 1.92 MB

2020

32

Demarcation Currents and Corner Field for Dynamic Resistance of HTS Coated Conductors

Zhang, Hongye, Hao, Chuantong, Xin, Ying, Mueller, Markus

Journal:

IEEE Transactions on Appiled Superconductivity

Année:

2020

Fichier:

PDF, 509 KB

2020